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Inclusive:
Design Rule Check
Before production we analyze data (Gerber
files) for manufacturability and if they comply with production
parameters. To avoid scrap we check them for typical design errors as
for example unrouted connections, tights, or too narrow line distances
and have them corrected before production starts.
Inclusive:
AOI, automatic optical inspection
We scan all PCBs and the inner layers of multilayer PCBs in an
automated optical test to find deviations in comparison to the layout
files. AOI will report opens and shorts, defects such as almost shorts,
almost opens, critical copper splashes, pinholes, over or under etched
tracks, blocked holes etc.
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Inclusive:
X-Ray Inspection (misalignment control)
This inspection makes sure that PCB layers and drillholes are correctly
positioned before laminating and drilling.
Inclusive:
Electrical testing
After manufacturing we perform a full continuity test checking each
board for shorts and opens (net list testing). For small quantitities
we apply a flying probe test.
To ensure full functionality this test implies:
E-Test, technical data |
Max. test area |
500 x 700 mm |
No of
test spots |
32800 |
Grid |
1/10 “ |
Insulation
test voltage |
25-250
V
(Standard 100 V) |
Test current |
max. 10 mA |
Circuit
test |
1 Ohm
- 2.5 kOhm |
Insulation test |
10 kOhm-100 MOhm |
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Optional: Controlled Impedance Testing, TDR test of panel coupons
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With shorter signal transmission times and high clock rates in modern
circuitry, the electrical properties of the traces carrying signals
become more important. PCBs with controlled impedance try to avoid
reflections and signal aberrations caused by the PCBīs configuration
i.e. material characteristics and dimensions, trace width and depth.
Prior to manufacturing we verify the board design and its impedance
requirements. To make sure that the board matches the specification
(the value and tolerance of impedance), we integrate test coupons into
the PCB panels and check with a TDR (time domain reflectometer) if
impedances are correct.
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